Circuit
Precisionat Scale.
IPC Class 3 workmanship. BGA, QFN, 0201 capability. Full lot traceability from solder paste batch to ship box.
Forty controlled steps.
Every one documented.
Click any card to see the equipment, the tolerance it holds, and a real metric from the last production run.
DFM Review
Design for Manufacturability
Every Gerber, BOM, and assembly drawing reviewed before a single stencil is cut. We flag tombstoning risks, insufficient courtyard clearances, and thermal relief issues before they cost you a spin.
Valor NX DFM Software + Cadence Allegro integration
Min. trace/space: 3mil/3mil | Min. via: 0.1mm drill
Stencil Cut
Laser Precision Apertures
Electroformed nickel stencils laser-cut to aperture tolerances that keep paste volume consistent across the entire panel. Nano-coating applied as standard on all stencils.
LPKF ProtoLaser ST + Electroform NiCo stencils
Aperture tolerance: ±0.5μm | Thickness: 0.08–0.25mm
Paste Print
Closed-Loop Squeegee Control
Servo-controlled print pressure with real-time paste height feedback. Every board receives SPI immediately after print — no boards advance with marginal paste deposits.
DEK Horizon 03iX with 3D SPI integration
Print pressure: ±0.1N | Squeegee speed: 20–150mm/s
SPI Inspection
3D Solder Paste Inspection
100% optical 3D measurement of every paste deposit. Volume, height, area, and offset measured against Gerber nominal. Boards with any out-of-spec deposit are reprinted, not reworked.
Koh Young Zenith II 3D SPI
Volume measurement: ±2% | Height resolution: 1μm
Placement
30,000 CPH Pick & Place
Dual-gantry SMT lines with vision alignment on every placement. 0201 components, 0.3mm pitch BGAs, and 01005s placed to ±25μm repeatability. Nozzle change and feeder validation logged per shift.
Fuji NXT III + Panasonic NPM-W2 dual-gantry
Placement accuracy: ±25μm | Min pitch: 0.3mm
Reflow
Nitrogen Atmosphere Profiling
Twelve-zone convection reflow under nitrogen blanket. Profile engineered per assembly — not a template. Thermocouple data archived per lot. Oxygen level maintained below 50ppm throughout soak and peak.
Heller 1912 EXL 12-zone nitrogen reflow
Peak temp: ±1°C | O₂ level: <50ppm | Profile archived
AOI
Automated Optical Inspection
Post-reflow AOI on 100% of boards. Component presence, polarity, solder joint geometry, and lifted leads all verified. False-call rate below 0.3% — operators review every flagged board.
Cyberoptics CyberGage360 + Mirtec MV-7Xi
Defect detection: 100% coverage | Pixel: 10μm
X-Ray
BGA Void & Joint Analysis
2D and 3D X-ray inspection for all BGA, QFN, and hidden-joint packages. Void percentage measured per IPC-7095. Every BGA lot receives a minimum 10% sample inspection; critical assemblies get 100%.
Nordson Dage XD7600NT X-ray system
Void limit: <25% per IPC-7095 | Resolution: 0.1μm
Functional Test
ICT + Flying Probe + Custom Fixtures
In-circuit test, flying probe, and customer-supplied functional fixtures all supported. Test coverage data logged per board serial. First-pass yield tracked lot-to-lot and shared in your delivery package.
Keysight i3070 ICT + Spea 4040 flying probe
Test coverage: >95% net | Board serial tracked
Ship
Traceable Packaging & Delivery
Lot traveler, CoC, SPI data, AOI images, X-ray reports, and reflow profiles ship with every order. Anti-static bags, moisture barrier packaging, and humidity indicators standard. Serialized label on every board.
Automated label applicator + ESD-safe pack station
MBB: per IPC/JEDEC J-STD-033 | Label: per IPC-7711
Numbers from
last month's production.
4,212-component mixed-technology assembly for a San Jose medical device startup. IPC Class 3 workmanship. 72-hour turn from BOM receipt to ship. Zero defects on AOI, X-ray, and functional test. Full data package delivered with shipment.
Circuit vs. Generic
Offshore House.
Twelve parameters. The table makes the case — the CTA just opens the door.
Ready to build
something real?
Drop your BOM and we'll have a quote back within 4 hours. No automated pricing engine — a real engineer reviews every BOM before we respond.
Request a Process Tour
Walk our SMT lines, meet the engineers who'll run your program, see the equipment firsthand. Available Monday–Thursday, 8am–4pm PST.